Link to inside page

Products:Reliability Information

Semiconductor Reliability Handbook

No. BDE0128D (Aug 2008)

click the title of each chapter to see document.

[1] The Toshiba Quality and Reliability System (PDF:312KB)
  1. The Toshiba Semiconductor Quality and Reliability
  2. Document Control
  3. Education and Training
  4. Specifications and Quality Agreements
  5. Quality and Reliability in Product Development and Design Changes
  6. Control of Parts, Materials and Subcontracting
  7. Manufacturing Process Control
  8. Identification and Traceability
  9. Measurement Control
  10. Quality Service Activities
  11. Quality Audits
  12. Inspection System
  13. Product Control after Final Inspection
  14. Logistic Quality Management System
  15. Action at the Time of Failure
  16. Statistical Process Control
  17. Complaint Services
  18. Environmental Quality of Products
[2] Semiconductor Reliability (PDF:674KB)
  1. Reliability Concept
  2. Factors Affecting Reliability
  3. Failure Mechanisms
[3] Reliability Testing (PDF:423KB)
  1. What is Reliability Testing
  2. Accelerated Life time Tests
  3. Failure Rate Estimation Methods
  4. Detailed Application Methods for Reliability Testing
[4] Failure Analysis and Reliability Improvement
  1. Significance of Failure Analysis (PDF:31KB)
  2. Instruments Used in Failure Analysis (PDF:63KB)
  3. Failure Analysis Procedure (PDF:175KB)
  4. Examples of Failure Analysis
    1. ASIC product failure location identification using EB tester image (PDF:497KB)
    2. Failure location identification using an emission microscope (PDF:268KB)
    3. Si chip backside analysis using an infrared emission microscope (IR EMS) (PDF:184KB)
    4. Failure location identification using IR-OBIRCH (PDF:74KB)
    5. Single element failure analysis using a nanoprobe (PDF:64KB)
    6. Failure location identification using an emission microscope and EB tester (PDF:379KB)
    7. Gate oxide film breakdown analysis using SEM (PDF:165KB)
    8. Interlayer particle analysis (PDF:234KB)
    9. TEM based cross-sectional analysis of failure location identified using OBIC (PDF:229KB)
    10. Analysis of fine particles in LSI using Auger electron spectroscopy (1) (PDF:292KB)
    11. Analysis of fine particles in LSI using Auger electron spectroscopy (2) (PDF:184KB)
    12. Coupling status analysis of minute part using XPS (PDF:106KB)
    13. Junction analysis using a scanning capacitance microscope (SCM) (PDF:193KB)
    14. Leak location identification using conductive AFM (PDF:51KB)
    15. Analysis of bonding pad corrosion (PDF:149KB)
    16. Analysis of cause of leakage between metallization on package substrate (PDF:77KB)
    17. Analysis of package crack by reflow of surface mounted device (PDF:154KB)
  5. Failure Analysis and Reliability Improvement Measures (PDF:26KB)
[5] Handling Precautions (PDF:544KB)
  1. Precautions for Semiconductor Product Use
  2. Safety Precautions
  3. General Safety Precautions and Usage Considerations
  4. Precautions and Usage Considerations Specific to Each Product Group
[6] Appendix (PDF:289KB)
  1. Sampling Inspection
  2. Mathematics of Reliability
  3. Derating Concepts and Methods

Top of this page